Paper “Double-Sided Process for MEMS SOI Sensors with Deep Vertical Thru-Wafer Interconnects” is accepted at IEEE JMEMS

Our paper “Double-Sided Process for MEMS SOI Sensors with Deep Vertical Thru-Wafer Interconnects” has been accepted as a journal paper for the upcoming JMEMS 2018 issue.

Authors:
A. Efimovskaya, Y. Lin, and A.M. Shkel