Below is a partial listing of the intellectual property developed within the MicroSystems Lab. For more information, please contact the UCI Office of Technology Alliances (OTA).
Licensing contact: Alvin K. Viray (949) 824-3104
| Date | Patent # | Title |
| 07/18/2023 | US Patent 11,703,330 B2 | Fused Quartz Dual Shell Resonator and Method of Fabrication Inventors: Asadian Ardakani; Mohammad H., Wang; Yusheng, Shkel; Andrei M. |
| 04/02/2019 | US Patent 10,247,554 B2 | Fully Balanced Micro-Machined Inertial Sensor Inventors: Senkal; Doruk, Zotov; Sergei A., Shkel; Andrei M. |
| 01/15/2019 | US Patent 10,180,323 B2 | Axi-symmetric small-footprint gyroscope with interchangeable whole-angle and rate operation Inventors: Senkal; Doruk, Shkel; Andrei M. |
| 01/01/2019 | US Patent 10,167,190 B2 | Low cost wafer level process for packaging MEMS three dimensional devices Inventors: Shkel; Andrei A., Efimovskaya; Alexandra, Senkal; Doruk |
| 07/31/2018 | US Patent 10,036,652 | Utilization of Mechanical quadrature in silicon MEMS vibratory gyroscope to increase and expand the long-term in-run bias stability Inventors: Zotov; Sergei A., Simon, Brenton; Prikhodko; Igor P.; Trusov; Alexander A., Shkel; Andrei M. |
| 07/11/2017 | US Patent 9,702,728 | Method of fabricating micro-glassblown gyroscopes Inventors: Shkel; Andrei M., Senkal; Doruk, Ahamed; Mohammed |
| 07/04/2017 | US Patent 9,696,340 | Multi-axis chip-scale MEMS inertial measurement unit (IMU) based on frequency modulation Inventors: Trusov; Alexander A., Zotov; Sergei A., Shkel; Andrei M. |
| 04/04/2017 | US Patent 9,611,138 | Through-Wafer Interconnects for MEMS Double-Sided Fabrication Process (TWIDS) Inventors: Efimovskaya A. and Shkel; Andrei M. |
| 08/30/2016 | US Patent 9,429,428 | Environmentally robust micro-wineglass gyroscope Inventors: Shkel; Andrei, Senkal; Doruk |
| 04/12/2016 | US Patent 9,310,199 | Micromachined gyroscopes with 2-DOF sense modes allowing interchangeable robust and precision operation Inventors: Schofield; Adam, Trusov; Alexander, Shkel; Andrei |
| 03/29/2016 | US Patent 9,296,133 | Method for batch fabrication of three-dimensional shells Inventors: Shkel; Andrei M., Trusov; Alexander A., Prikhodko; Igor P., Zotov; Sergei A. |
| 03/01/2016 | US Patent 9,274,136 | Multi-axis chip-scale MEMS inertial measurement unit (IMU) based on frequency modulation Inventors: Trusov; Alexander A., Zotov; Sergei A., Shkel; Andrei M. |
| 12/22/2015 | US Patent 9,217,756 | Lever mechanisms for anti-phase mode isolation in MEMS tuning-fork structures Inventors: Simon, Brenton, Trusov A., Shkel; Andrei M. |
| 09/22/2015 | US Patent 9,139,417 | Microfabrication of high quality three dimensional structures using wafer-level glassblowing of fused quartz and ultra low expansion glasses Inventors: Trusov A., Senkal D., Shkel A. |
| 03/31/2015 | US Patent 8,991,247 | High range digital angular rate sensor based on frequency modulation Inventors: Trusov A., Zotov S., Shkel A. |
| 08/12/2014 | US Patent 8,800,370 | Micromachined gyroscopes with 2-DOF sense modes allowing interchangeable robust and precision operation Inventors: Schofield; Adam, Trusov; Alexander A., Shkel; Andrei M. |
| 10/29/2013 | US Patent 8,567,247 B2 | Three-dimensional wafer-scale batch-micromachined sensor and method of fabrication for the same Inventors: Shkel; A., Trusov; A., Prikhodko; I., Zotov; S. |
| 10/08/2013 | US Patent 8,549,915 | Micromachined gyroscopes with 2-DOF sense modes allowing interchangeable robust and precision operation Inventors: Schofield; A., Trusov; A., Shkel; A. |
| 02/05/2013 | US Patent 8,368,154 B2 | Three dimensional folded MEMS technology for multi-axis sensor systems Inventors: Trusov A., Rivers M., Zotov S., Shkel A. |
| 12/18/2012 | US Patent 8,334,984 | Single wafer fabrication process for wavelength dependent reflectance for linear optical serialization of accelerometers Inventors: Perez; M., Shkel; A. |
| 12/04/2012 | US Patent 8,322,213 | Micromachined tuning fork gyroscopes with ultra-high sensitivity and shock rejection Inventors: Trusov; Alexander A., Schofield; Adam, Shkel; Andrei M. |
| 11/27/2012 | US Patent 8,318,524 | Single wafer fabrication process for wavelength dependent reflectance for linear optical serialization of accelerometers Inventors: Perez; M., Shkel; A. |
| 04/10/2012 | US Patent 8,151,600 | Self-inflated micro-glass blowing Inventors: Eklund; Erik J., Shkel; Andrei M. |
| 02/14/2012 | US Patent 8,113,050 | Robust six degree-of-freedom micromachined gyroscope with anti-phase drive scheme and method of operation of the same Inventors: Acar; Cenk, Shkel, A. M., Schofield; Adam R., Costlow; Lynn E., Madni; Asad M. |
| 01/10/2012 | US Patent 8,094,841 | Apparatus and method using capacitive detection with inherent self-calibration Inventors: Trusov; Alexander A., Shkel, A. M. |
| 05/10/2011 | US Patent 7,939,355 | Single-mask fabrication process for linear and angular piezoresistive accelerometers Inventors: Eklund; Erik J., Shkel; Andrei M. |
| 01/18/2011 | US Patent 7,872,473 | Compact atomic magnetometer and gyroscope based on a diverging laser beam Inventors: Kitching; John, Donley; Elizabeth A., Hodby; Eleanor, Shkel, A. M., Eklund; Erik Jesper |
| 04/13/2010 | US Patent 7,694,531 | Method and Apparatus for Wafer-Level Micro-Glass Blowing Inventors: Eklund, E. J. and Shkel, A. M. |
| 09/09/2008 | US Patent 7,421,898 World Patent WO 02/088631 | Torsional nonresonant z-axis micromachined gyroscope with non-resonant actuation to measure the angular rotation of an object Inventors: Acar, C. and Shkel, A. M. |
| 05/27/2008 | US Patent 7,377,167 World Patent WO 02/066927 | Nonresonant micromachined gyroscopes with structural mode-decoupling Inventors: Acar, C. and Shkel, A. M. Exclusively Licensed to BEI/Systron Donner Automotive, Assigned to The Regents of the University of California |
| 10/23/2007 | US Patent 7,284,430 | Robust micromachined gyroscopes with two degrees of freedom sense-mode oscillator Inventors: Acar, C. and Shkel, A. M. Exclusively Licensed to BEI/Systron Donner Automotive, Assigned to The Regents of the University of California |
| 10/09/2007 | US Patent 7,279,761 | Post-release capacitance enhancement in micromachined devices and a method of performing the same Inventors: Acar, C. and Shkel, A. M. |
| 09/05/2006 | US Patent 7,100,446 | Distributed-mass micromachined gyroscopes operated with drive-mode bandwidth enhancement Inventors: Acar, C. and Shkel, A. M. |
| 05/09/2006 | US Patent 7,040,164 | Method of simultaneously and directly generating an angular position and angular velocity measurement in a micromachined gyroscope Inventors: Painter C. and Shkel A.M. Exclusively Licensed to MEMSense Inc., Assigned to The Regents of the University of California |
| 08/23/2005 | US Patent 6,934,660 | Multi stage control architecture for error suppression in micromachined gyroscopes Inventors: Painter C. and Shkel A.M. |
| 08/16/2005 | US Patent 6,928,874 | Dynamically amplified micromachined vibratory angle measuring gyroscopes, micromachined inertial sensors and method of operation for the same Inventors: Painter C. and Shkel A.M. |
| 01/25/2005 | US Patent 6,845,669 World Patent WO02/08863 | Non-resonant four degrees-of-freedom micromachined gyroscope Inventors: Acar, C. and Shkel, A. M. Exclusively Licensed to BEI/Systron Donner Automotive, Assigned to The Regents of the University of California |
| 03/11/2003 | US Patent 6,531,332 | Surface micromachining using a thick release process Inventors: Shkel A.M., Little M. |
| 11/09/2002 | US Patent 6,481,285 | Micro-machined angle-measuring gyroscope Inventors: Shkel A. M. and Howe R. T. |
| 08/06/2002 | US Patent 6,430,333 | Monolithic 2D optical switch and method of fabrication Inventors: Little M. and Shkel A. M. |