Semiautomatic Dicing Saw (DISCO DAD3220)

Semiautomatic Dicing Saw (DISCO DAD3220)

Quality oriented* spindle dicing to separate die from wafers
Compatible wafer materials: Silicon, glass & quartz, fused silica

*stable, high grade blades are used

Specifications for standard procedure
Wafer size < 6 inches
Maximum wafer thickness typical: ~1.2 mm (Please inquire for wafer thickness between 1.2 – 2.4 mm)
Acceptable dicing street gap (range depending on wafer thickness) 30~65 µm (Silicon); 100~150 µm (Quartz)
Rates (tentative)
UC-system $31/hr
Others $80/hr


 AML-AWB Aligner- 4” Wafer Bonder

Wafer Bonder (AML-AWB Aligner)

1. Anodic Bonding

Wafer-level anodic bonding / field assisted bonding service of joining glass to silicon. The system is equipped with in-situ alignment with 1-5 micron accuracy depending on options & wafers.
Compatible wafer materials: Si, Pyrex 7740, Borofloat 33

Specifications for standard procedure
Wafer size 4 inches
Minimum wafer thickness Glass: 200 µm; Si: 100 µm

2. Thermo-Compression Bonding

Thermo-compression bonding bonds two wafers through an adhesion metal. Suitable for applications requiring sealing of evacuated cavities.
The system is equipped with in-situ alignment with 1-5 micron accuracy depending on options & wafers.

Specifications for standard procedure
Wafer size 4 inches
Compatible adhesive metals Au, Cu, Al
Operation Rates (tentative)
UC-system $48/hr
Others $120/hr
Equipment Conditioning Rates (tentative)
UC-system $6/hr
Others $45/hr