UCI MicroSystems Lab Bonding Service Interest Form First Name * Last Name * Organization / Affiliation * Email * Bonding Type * Anodic bondingThermo-Compression bondingOthers Adhesive Metal Type * AuCuAl Bonding Type (Others) Wafer 1 Material & Thickness * If Si, thickness ≥ 100 μm; If glass (Pyrex 7740, Borofloat 33), thickness ≥ 200 μm Wafer 2 Material & Thickness * Aligned Bonding YesNo If yes, alignment marks must be present Comments on Proposed Recharge Rates The proposed rate is reasonable for the service providedThe proposed rate should be raised (higher) to ensure best qualityThe proposed rate should be lowered Operation rate // Equipment Conditioning rate: UC-system: $48/hr // $6/hr, Non-university Entities: $120/hr // $45/hr Additional Comments on Proposed Recharged Rates * Please enter your proposed amount and your reason for the higher/lower rate Comments More information: https://mems.eng.uci.edu/services/ reCAPTCHA This form is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply. Submit