A new patent has been issued on February 5, 2013: ” Three dimensional folded MEMS technology for multi-axis sensor systems “. The patent was featured in the MEMS Investor Journal newsletter among “the Notable New Patents”. [PDF]
A new patent has been issued on February 5, 2013: ” Three dimensional folded MEMS technology for multi-axis sensor systems “. The patent was featured in the MEMS Investor Journal newsletter among “the Notable New Patents”. [PDF]