Month: December 2017

Paper “Double-Sided Process for MEMS SOI Sensors with Deep Vertical Thru-Wafer Interconnects” is accepted at IEEE JMEMS

Our paper “Double-Sided Process for MEMS SOI Sensors with Deep Vertical Thru-Wafer Interconnects” has been accepted as a journal paper for the upcoming JMEMS 2018 issue. Authors: A. Efimovskaya, Y. Lin, and A.M. Shkel…Continue Reading Paper “Double-Sided Process for MEMS SOI Sensors with Deep Vertical Thru-Wafer Interconnects” is accepted at IEEE JMEMS

Paper “High quality factor MEMS gyroscope with whole angle mode of operation” is accepted at IEEE INERTIAL’18

Our paper on “High Quality Factor MEMS Gyroscope with Whole Angle Mode of Operation” has been accepted for presentation in the upcoming INERTIAL 2018 Conference. Authors: S. Askari, M. H. Asadian, and A.M. Shkel…Continue Reading Paper “High quality factor MEMS gyroscope with whole angle mode of operation” is accepted at IEEE INERTIAL’18